HCC4076B
HCF4076B
4 BIT D TYPE REGISTERS
.THREE STATE OUTPUTS
.INPUT DISABLE WITHOUT GATING THE
CLOCK
.GATED OUTPUT CONTROL LINES FOR EN-
ABLING OR DISABLING THE OUTPUTS
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.5V, 10V AND 15V PARAMETRIC RATINGS
EY F
.INPUT CURRENT OF 100nA AT 18V AND 25oC (Plastic Package) (Ceramic Package)
FOR HCC DEVICE
.100% TESTED FOR QUIESCENT CURRENT
.MEETS ALL REQUIREMENTS OF JEDECTEN-
TATIVE STANDARD N. 13A, STANDARD
SPECIFICATIONS FOR DESCRIPTION OF B
SERIES CMOS DEVICES
M1 C1
(Micro Package) (Chip Carrier)
ORDER CODES :
HCC4076BF HCF4076BM1
HCF4076BEY HCF4076BC1
PIN CONNECTIONS
DESCRIPTION
The HCC4076B (extended temperature range) and
HCC4076B (intermediate temperature range) are
monolithic integrated circuit, available in 16 lead
dual in line plastic or ceramic package and plastic
micropackage.
The HCC/HCF4076B types are four-bit registers
consisting of D-type flip-flops that feature three-
state outputs. Data Disable inputs are provided to
controlthe entryof data into theflip-flops. Whenboth
Data Disable inputs are low, data at the D inputs are
loaded into their respective flip-flops on the next
positive transition of the click input. Output Disable
inputs are also provided. When the Output Disable
inputs are both low, the normal logic states of the
four outputs are available to the load. The outputs
are disabled independently of the clock by a high
logic level at either Output Disable input, and pres-
ent a high impedance.
September 1988 1/13
HCC/HCF4076B
FUNCTIONAL DIAGRAM
ABSOLUTE MAXIMUM RATING
Symbol Parameter Value Unit
V * Supply Voltage: HCC Types -0.5 to +20 V
DD
HCF Types -0.5 to +18 V
Vi Input Voltage -0.5 to VDD + 0.5 V
II DC Input Current (any one input) Ä… 10 mA
P Total Power Dissipation (per package) 200 mW
tot
Dissipation per Output Transistor
for Top = Full Package Temperature Range 100 mW
o
T Operating Temperature: HCC Types -55 to +125 C
op
o
HCF Types -40 to +85 C
o
T Storage Temperature -65 to +150 C
stg
Stressesabove those listedunder Absolute Maximum Ratings may cause permanent damage to thedevice. This isa stress ratingonly and functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for external periods may affect device reliability.
* All voltage values are referred to V pin voltage.
SS
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V Supply Voltage: HCC Types 3 to 18 V
DD
HCF Types 3 to 15 V
VI Input Voltage 0 to VDD V
o
Top Operating Temperature: HCC Types -55 to +125 C
o
HCF Types -40 to +85 C
2/13
HCC/HCF4076B
LOGIC DIAGRAM
TRUTH TABLE
DATA INPUT DISABLE DATA NEXT STATE
RESET CLOCK
D OUTPUT G
G1 G2
1XXXX0
00XXXQ NC
0 1XXQ NC
0XX NC
1Q
001
01
000
00
01XXXQ NC
0 XXXQ NC
Wheneither Output DisableMor Nis high, theoutputs aredisablesd (high impedance state): however sequential operation of the flip-flopisnot affected.
1 = High Level, 0 = Low Level, X = Don t Care, NC = No Change
3/13
HCC/HCF4076B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditios Value
o
Symbol Parameter Unit
V V |I | V T *25 CT *
I O O DD LOW HIGH
(V) (V) (µA) (V)
Min. Max. Min. Typ. Max. Min. Max.
I Quiescent 0/5 5 5 0.04 5 150
L
Current HCC
0/10 10 10 0.04 10 300
Types
0/15 15 20 0.04 20 600
µA
0/20 20 100 0.08 100 3000
0/5 5 20 0.04 20 150
HCF
0/10 10 40 0.04 40 300
Types
0/15 15 80 0.04 80 600
VOH Output High 0/5 < 1 5 4.95 4.95 4.95
Voltage V
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
VOL Output Low 5/0 < 1 5 0.05 0.05 0.05
Voltage V
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
VIH Input High 0.5/4.5 < 1 5 3.5 3.5 3.5
Voltage V
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
VIL Input Low 4.5/0.5 < 1 5 1.5 1.5 1.5
Voltage V
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
IOH Output 0/5 2.5 5 -2 -1.6 -3.2 -1.15
Drive HCC
0/5 4.6 5 -0.64 -0.51 -1 -0.36
Current Types
0/10 9.5 10 -1.6 -1.3 -2.6 -0.9
mA
0/15 13.5 15 -4.2 -3.4 -6.8 -2.4
0/5 2.5 5 -1.53 -1.36 -3.2 -1.1
HCF
0/5 4.6 5 -0.52 -0.44 -1 -0.36
Types
0/10 9.5 10 -1.3 -1.1 -2.6 -0.9
0/15 13.5 15 -3.6 -3.0 -6.8 -2.4
I Output 0/5 0.4 5 0.64 0.51 1 0.36
OL
HCC
Sink
0/10 0.5 10 1.6 1.3 2.6 0.9
Types
Current
0/15 1.5 15 4.2 3.4 6.8 2.4 mA
0/5 0.4 5 0.61 0.44 1 0.36
HCF
0/10 0.5 10 1. 1.1 2.6 0.9
Types
0/15 1.5 15 3.6 3.0 6.8 2.4
I , I Input Leakage 0/18 18 Ä…0.1 Ä…10-5 Ä…0.1 Ä…1 µA
IH IL
Any Input
Current
0/15 15 Ä…0.3 Ä…10-5 Ä…0.3 Ä…1 µA
I , I Input HCC
OH OL
0/18 0/18 18 Ä…0.4 Ä…10-4 Ä…0.4 Ä…12 µA
Leakage Types
Current
HCF
0/15 0/15 15 Ä…1.0 Ä…10-4 Ä…1.0 Ä…7.5 µA
Types
CI Input Capacitance Any Input 5 7.5 pF
o o
* T =-55 CforHCC device: -40 C for HCF device.
LOW
o o
* T =+125 Cfor HCC device: +85 C for HCF device.
HIGH
The Noise Margin for both 1 and 0 level is: 1V min. with V = 5 V, 2 V min. with V = 10 V, 2.5 V min. withV =15V
DD DD DD
4/13
HCC/HCF4076B
o
DYNAMIC ELECTRICAL CHARACTERISTICS (T = 25 C, C = 50 pF, R = 200 K&!,
amb L L
typical temperature coefficent for all V values is 03 %/oC, all input rise and fall times= 20 ns)
DD
Test Conditions Value
Symbol Parameter Unit
V (V) Min. Typ. Max.
DD
t Propagation Delay Time 5 300 600
PLH
t (Clock to Q Output) ns
PHL
10 125 250
15 90 180
tPHL(R) Propagation Delay Time 5 230 460
(Reset) ns
10 100 200
15 75 150
tP(1-H) 3-State Output 1 or 0 to High Impedance RL = 1K&! 5 150 300
tP(0-H) ns
10 75 150
15 60 120
t 3-State High Impedance to 1 or 0 Output R = 1K&! 5 150 300
P(H-1) L
t ns
P(L-1)
10 75 150
15 60 120
tW Clock Pulse Width 5 200 100
ns
10 100 50
15 80 40
tW Reset Pulse Width 5 120 60
ns
10 50 25
15 40 20
t Data Setup Time 5 200 100
setup
ns
10 80 40
15 60 30
t Data Input Disable Setup Time 5 180 90
setup
ns
10 100 50
15 70 35
fmax Maximum Clock Frequency 5 3 6
MHz
10 6 12
15 8 16
tr, tf Clock Input Rise or Fall Time 5 15 µs
10 5
15 5
5/13
HCC/HCF4076B
Typical Output Low (sink) Current Characteristics Minimum Output Low (sink) Current Charac-
teristics
Typical Output High (source) Current Charac- Minimum Output High (source) Current Charac-
teristics teristics
Typical Maximum Clock Input Frequency vs Sup- Typical Dynamic Power Dissipation vs Fre-
ply Voltage quency
6/13
HCC/HCF4076B
Typical Propagation Delay Time vs Capacitance Typical Transition Time vs Load Capacitance
WAVEFORMS
7/13
HCC/HCF4076B
TEST CIRCUITS
Quiescent Device Current. Noise Immunity.
Input Leakage Current.
8/13
HCC/HCF4076B
Plastic DIP16 (0.25) MECHANICAL DATA
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
P001C
9/13
HCC/HCF4076B
Ceramic DIP16/1 MECHANICAL DATA
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053D
10/13
HCC/HCF4076B
SO16 (Narrow) MECHANICAL DATA
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8° (max.)
P013H
11/13
HCC/HCF4076B
PLCC20 MECHANICAL DATA
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
12/13
HCC/HCF4076B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproducts are not authorized for use ascritical componentsin life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
© 1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
13/13
Wyszukiwarka